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Probably not good Posted by Ari [Email] ![]() ![]() In Reply to: RoHS Solder technology in the future, Bill Homer ![]() |
Lead Free (LF) solders typically melt about 20 degrees C higher than Pb-based solder. Reviewing the literature, my guess is that there will be a few years where manufacturers are still getting used to the new processes, and that will contribute to failures. There has been a lot of study of Pb solder, but not as much on the LF alternatives. One of the biggest failure modes is due to differences in thermal growth between the circuit board and the solder; until the board materials catch up, there will be issues.
In general, LF solder is less ductile, so it doesn't respond to vibration as well as Pb solder. From what I've seen, it's vibration that kills the solder joints, because the ones that fail are almost always associated with large components (relays).
It's my guess that we'll have about 10 years of issues as LF solders kick in. But eventually two things will bring the problem into line - the first is better compatibility of circuit boards and the solder. The second is the trend away from big electromechanical devices, such as relays, on boards. As those phase out, there will be less stress on the solder joints, and they'll live longer. But till then, keep your soldering iron around.
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